Hello Jim,
This is regarding the silanization treatment on wafer
to help remove the PDMS mold after patterning. I am
quoting what you mentioned to me in an earlier e-mail.

"treatment by putting the silicon wafer in a
 dessicator with a small beaker containing a few drops
of
tridecafluoro-1,1,2,2-tetrahydooctyl)trichlorosilane.

 Pump on the dessicator with a small lab pump."

Sorry to bother you again with this..but I plan to try
this process this week. This is what I plan to do.
Keep the wafer inside the dessicator and then place a
beaker with trichlorosilane(will jsut a few drops be
sufficient? or should I have like 10ml or soemthing?)
and am going to pump some air fom the house air-line.
Do you have any specifics regarding the air pressure
and the duration for this from your experience of how
this works for you. Usually, I do an HMDS coating and
it works but I want to try this process this time. I
appreciate your reply.

Thanks a lot,
Aravind

--- Jim Beall  wrote:

> On Nov 2, 2004, at 5:04 PM, Aravind wrote:
> > Hello All,
> > I am just looking to find out what methods you
> guys
> > use to remove the PDMS mold from silicon wafers
> that
> > has shapes ethced onto it.
>
>
> We have successfully used either:
>
> 1)a brief CHF3 plasma treatment of the micromachined
> silicon surface in
> a small RIE chamber. This deposits a thin
> "teflon-like" release layer,
> or
>
> 2) treatment by putting the silicon wafer in a
> dessicator with a small
> beaker containing a few drops of
>
tridecafluoro-1,1,2,2-tetrahydooctyl)trichlorosilane.
> Pump on the
> dessicator with a small lab pump.
>
> Jim
> >
> 303-497-5989
>
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