Dear Regan,

Please refer the following paper :

"Wafer to wafer bonding for Microstructure formation" by Martin A.
Schimidt - Procedding of teh IEEE Vol 86, No. 8 Aug. 1998.

its a good one and tells different wafer bonding techniques.

I will fwd you this paper, when i will go to my lab.

Thanks,
Pradeep Dixit
NTU Singapore


On Fri, 19 Nov 2004 18:12:40 +0900, Regan Nayve
 wrote:
> Dear MEMS members,
>
> I want to know the different types of substrate bonding. Could
> anyone recommend a website or article that deals with this
> topic in a broad manner but also have detailed contents?
>
> Thanks,
> Regan
>
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