Hi,

Is there any method to bond a Si wafer (200-300 microns ) to second Si
wafer having Cu seed layer of 0.25 microns. I need to seprate these
wafers after some time.

I will be thankful to any one who can send me any receipe/process
parameters of this type of wafer bonding.

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Thanks,
Pradeep Dixit
Research Student,
Micromachine Center,
NTU Singapore - 639669