Hi everyone,
I am trying to deposit a resistor layer and I thought using TaN would be
a good idea. Has anyone deposited TaN before using any technique? If
yes, was that sputtering or evaporation? I believe sputtering target is
expensive, would it help if I go toward evaporation? Is there any
concern that I should take it in to account?

I would really appreciate your answers.
Thanks in advance
Mojgan