Mojgan,

I tried an evaporation technique in conjunction with an N2 -ed ion gun
bombarding the substrates during the deposition, hoping that it would be
incorporated into the Ta film, but this produced widely variable results with
respect to sheet resistance.

Another thing to consider is the patterning.  Evaporated Tantalum goes on too
hot for many lift-off processes, and most TaN etches are not selective to SiO2.

A sputtered film is more repeatable.

Neal