> I am trying to deposit a resistor layer and I thought using TaN would be
> a good idea. Has anyone deposited TaN before using any technique? If
> yes, was that sputtering or evaporation? I believe sputtering target is
> expensive, would it help if I go toward evaporation? Is there any
> concern that I should take it in to account?

TaN is one of the choices to achieve very low TCR.

Substrate temperature and uniformity of N2 distribution are
critical, so best results can be expected from sputtering systems
with substrate temperature control.

--
Klaus Beschorner
Metron Technology, European Applications Manager
Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683