The best approach might be to use lift off of the triple stack (if it is not too
thick) in the pattern of the interconnect circuitry, then use the "resistor
reveal" technique to pattern the resistor itself.  So the stack is TaN under TiW
under Gold and is patterned by lift-off to form the interconnect.  Then
repattern with resist, etching Au then TiW from the resistor area only, exposing
the TaN resistor.

Neal