We have a problem with the adhesion of Ni sputtered/electroplated on Si.
Our process is the following:
1) Sputtered a 20nm Titanium adhesion layer on a Si wafer.
2) Sputtered a 200nm Nickel layer on the previus Ti Layer.
3) Electroplated a 400/1400nm Nickel layer on the sputtered layer

After the electroplating process we see that the nickel sputtered and
electroplated (but not the Titanium layer) delaminates (but not the Titanium
layer) from the wafer if we touch that.

Without the titanium layer we saw that the nickel delaminates when we just
pulled the wafer out from the electroplating bath.

We thought about mechanical stress in the Nickel sputtered layers.

With another configuration (10 nm evaporated Titanium / 200 nm evaporated nickel
/ 400-1400 nm electroplated Nickel) we haven't a delamination.

Anyone could suggest other reasons for the delamination or any solution

Thanks

Federico