Could someone suggest an adhesive for bonding wafers that that can be
patterned and will survive ~24 hr in 25% TMAH at 80degC. The material
should solidified before bond so the wafers can be aligned without
making a mess.

I have used Protek from Brewer Science, but Protek can't be patterned
before etch.  I have also had some success with unexposed SU8, but the
exposed SU8 peels in TMAH.

Roger Shile