Dear community members,

I'm searching for well working PR which can be used as an etching mask for
RIE (CHF3, Ar, some little O2).
The smallest feature will be in range of 60 nm and the resist should be
enough thick to pattern about 800 nm thick Si layer.

The proposed process is high resolution e-beam writing of PMMA, lift-off
with Ni and etching of PR mask by means of dry etching.
I heard some AZ resist work well, but as I searched for clariant products,
they do not offer any etch resistant resist covering sub-micrometer range of
thickness.

Any recomendation or comments are highly welcome

Thanks

Josef Kouba