Any kind of resist, for example: shipley 1813, 1827 or 9260 can be used in
the RIE system.

I personally have tried a layer o5 5 microns of 1827, and it has worked
fine for me.

AFter the etch is done, you can put the wafer in acetone or PRS 2000 and
the resist will be removed.

On Wed, 9 Feb 2005, Guiti Zolfagharkhani wrote:

> I need to do RIE for at least 3 minutes to etch through the Si. Does
> anybody know about a photoresist that can be used as a mask in RIE ?I also
> need to know how to remove the photoresist after RIE process.