Hi,
  Is there anybody who can help me, on SU-8 and PDMS bonding?

  I'm going to make a micro-channel with SU-8 on Siliocn wafer and cover it
 with PDMS cover.

 I'm afraid that the bonding strength between SU-8 and PDMS cover is not good
enough.

 So far, the thing I found out is to use O2 plasma etching to activate the
surface and
 to bond the SU-8 and PDMS at 120'C with some pressure.

 If you can give me some advices on the general bonding process or
 how to increase the bonding strength between SU-8 and PDMS,
 I'll really appreciate it.

Thanks,
Kidong