hi everybody,

  Does anyone know how we can bind two wafers, one of which is Si and
has 50micron-high Su-8 patterns on top, under 100 degrees centigrade?
The other wafer is glass, and any easy-to-use bounding chemical, only
if it can keep the surface micron-scale smooth, can be applied if
necessary. I simply want to avoid temperature higher than 100degree in
order to avoid possible damage to the GMR sensors on the Si wafer.

 cheers