Hi everybody,
I'm trying to wire-bond to Pt pads using Au wire.  I'm using an ancient West-
bond wedge bonder, the wire is, I believe, 30 um diameter, and currently I'm
having luck doing the termination bonds using medium power for a long time. I
have the package at 350
C, and I think the chip surface is about 280.

I was wondering if anyone out there has some advice on how to do a starting
bond, and how to zero in on better quality bonds.

Also, I'm looking for a wire-bonding service in the Los Angeles area for a batch
of about 50 chips with 20 wires per chip (~2000 bonds).

I looked through the list about a month ago, with sparse information presenting
itself.

Thanks,
Jesse Fowler