I vaguely remember reading this experimental result: if you cure a thin
layer of PDMS on a rigid substrate at high temperature, it cures in an
expanded state (just from thermal expansion). Then when the PDMS comes
down to room temperature, it's under tensile stress, and the stress is
roughly proportional to the temperature it was cured at. The rigid
substrate does not contract significantly. (Note that it's not talking
about the modulus of elasticity changing with the cure temperature.) I
would like to use this fact (and reference the author) in on of my
fabrication processes that will be published, but I cannot locate the
paper. If anyone knows the source for the result mentioned above, please
let me know.

Regards,
Rick