I don't know about etch-resistance, but HSQ is essentially
SiO2 after exposure, so removing it could be an issue (maybe
HF?).  As far as handling, you should look up the MSDS.  I
believe HSQ uses MIBK as a solvent.  Our group as used HSQ in
50kV JEOL E-beam system for gratings down to 30 nm period.

Bill

>
>Hi MEMS-Talkers,
....
>What is your opinion on these resist of HSQ and NEB for my
purpose
>regarding etch resistance, resolution, removal, and handling
of the resist?