Hello everyone,
I wanted to use the DRIEed surface of the (100) silicon wafer was mirrors. Due
to the scalloping in DRIE the surface is scattering a  lot of light. I did the
CF4/O2 plasma on the wafer and then I was trying to use HNA as the polishing
solution with the given concentration (HF:HNO3:H2O:: 20:60:160). Still I am
getting scattering off the wafer. Can any one suggest me a better ratio to try
or even a different recipe or method might help.
Thanks
Rahul Agarwal
University of south Florida
Tampa, fl - 33613