hi MEMS members,

I am planning to fabricate photonic crystal on SOI where my device layer is
300nm and i need to drill holes on the device layer using Cr as hard mask.To
remove SiO2 buffer layer i am using BHF. i would like to know what effect will
BHF have on Cr hard mask.

shankar kumar,
IOMS,university of twente,
the netherlands.