Dear Fellows,

I am trying to do a lift-off for a microfluidic chip and facing some problems. I
am using AZ9260 and then I exposed my mask onto it. Once the features were
defined, I evaporated Ti 200A and Pt 1200A onto the wafer.

When I tried the lift off, most of the metal broke off from the wafer and metal
on some features has been washed out completely. The part of the wafer with
AZ9620 also had a grainy metal surface.

It would be great if someone could help.

Rameez