Hi doing.
 We are making the mask for Deep X-ray lithography.
Whenever we try to electroplate the gold on the Si substrate with seed layer
Au/Cr. It appears the phenomenon to permeate into the bottom, to plate on
bottom and to raise the PR.
Could you give me some suggestions on how to solve this problem?
Then I really appreciate that.

Suk Sang Chang
[email protected]
POSTECH/PAL
Korea