hi Vinit,
your Ti layer is probably too thin, what thickness are you using? Also the
brown layer is from the PR deposition process, never checked it but I assume
oxidation of the Ti. 1000A of Ti/W works well for me and gives me the
ability to use the seed layer a few times if rework is needed, also Ti/W can
be dry etched very easily...... SF6 or fluorocarbon will do. PEPR is not an
easy resist to work with, theres alot of stuff that can go wrong. bath
aging, metal contam., bacteria (they love this stuff). just too much to talk
about in one email. good luck
eric

>    9. Issues with PEPR 2400  ([email protected])
> 1.
> I have been coating PEPR 2400 ED on Ti-coated Si wafers. the Si wafers
> have anisotropically etched pits (~200 um). Post-exposure development (in
> 0.2 NaOH) leads to removal of alot of resist-patterns. I have tried it at
> different temperatures the result is the same.
>
> 2.
> What is the best stripper for the PEPR 2400 ? I have tried 0.2/0.3 NaOH (@
> 30-60 degrees celsius) and Acetone. they all leave a very mild, but
> visible brown layer.