Hi All

I was wondering does anybody have any idea of the minium thickness of a silicon
membrane that can be machined using an STS ICP Bosch etcher (or any toher bosch
etcher).The system uses helium backside cooling which might 'pop' the membrane
below a certain thickness. The trench width is 90um.

I was hoping to get down below 20um, maybe to 10um. I've seen some papers in
which they describe using a mounting wafer but it would be preferable not to do
this for our application.

Any help would be greatly appreciated.

Thanks
Rob
[email protected]