Hello,

We need to etch a pattern in silicon wafers.  The requirements for this
pattern are the following.
1. The etch depth is: (case a) 100 micrometers +/- 1 micrometer,
(case b) 200 micrometers +/- 2 micrometers.
2. The etch pattern is an array of 2 mm wide slots on a 1.0 mm spacing
3. Vertical side-walls to within 0.01 radians.
4. Smooth side-wall surfaces, roughness less than 0.5 micrometers.
5. Smooth bottom surface, roughness less than 0.5 micrometers
6. The inside corner where the side-wall meets the bottom surface needs
to be a clear-and-free 90 degree angle +/- 0.5 degrees.

Our questions are:
1. Does current silicon etching technology meet these requirements?
2. Are there vendors who will do this etching for us?

Thank you in advance for your replies.
Steve Kwiatkowski