[email protected] wrote:

> Dear MEMS experts,
>
> I have no experience in KOH and TMAH etching of Si.  Could someone
> tell me if hard baked photoresist and cured polyimide withstand
> these Si etchants?
>
> Any suggestion is greatly appreciated. Thanks.
>
> Marvin
>

 Hi Marvin,

I have used TMAH to etch Si, and it will not preserve the PR.  If you
want to mask the Si in certain areas oxidise the Si and pattern it.
TMAH will etch SiO2 but at a much slower rate than it does exposed
Si. So if you have atleast 1 micron or 1.5 micron oxide, you should
be fine.

Kirthi

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        Kirthi Roberts        *
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        School of Engineering Science *
        Simon Fraser University       *
        Vancouver, Canada             *
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e-mail : [email protected]      *
Tel : (604) 291-3815          *
FAX : (604) 291-4951          *
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