About 5 minutes of plasma activation on the 2 wafers with the active
face up. Think about 1 watt per square inch plasma power capacitive
plasma generator for even power across the wafer.  Use oxygen plasma if
there is no problem with metalic oxidation.  Then place active faces
together and apply even pressure.  The plama

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I need to bond two silicon wafers directly, I appreciate if anybody knows any
condition.