>I have no experience in KOH and TMAH etching of Si.  Could someone
>tell me if hard baked photoresist and cured polyimide withstand
>these Si etchants?

I'd be interested in the answers to this as well.  I know that PR peels off
in KOH so I use nitride for KOH or oxide for TMAH, but I don't know about
polyimide.  Please send me that info.
Justin D. Mansell                | "If your opponent strikes with fire,
Ginzton Laboratory               |         counter with water."
Stanford, CA 94305               | "To injure an opponent is to injure
tel: 650-725-2266                |          yourself."
fax: 650-723-2666                |              -Morihei Ueshiba
http://www.stanford.edu/~jmansell|