A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Re: Removal of Cured Polyimide
Re: Removal of Cured Polyimide
1998-02-20
Patrick C.P. Cheung
1998-02-19
Eui-Hyeok(EH) YANG
1998-02-26
Ralf Keller
1998-02-26
Ralf Keller
Re: Removal of Cured Polyimide
Ralf Keller
1998-02-26
Hallo Sergio,

cured Polyimide (I use PI 2611) is attacked by KOH and TMAH. This does not
attack your metal but there may be problems if you use a Si-substrate.
You can also try some developers like AZ 312 MIF. It contains TMAH in a low
concentration and it also attacks PI.

If you have any other information about etching or removing of PI, I would
be very interested in.

Ralf

******************************************************
Dipl.-Ing. Ralf Keller

Fraunhofer-Institut fuer Biomedizinische Technik IBMT
Abteilung Sensorsysteme / Mikrosysteme
Ensheimer Str. 48
66386 St. Ingbert
Germany
Tel.: +49 (0) 6894 / 980-158
Fax: +49 (0) 6894 / 980-400
e-mail: [email protected]
http://www.ibmt.fhg.de


reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Process Variations in Microsystems Manufacturing
MEMS Technology Review
MEMStaff Inc.
Harrick Plasma, Inc.