>I am using cured polyimide (PI 2545) as a sacrificial layer in a process
>to
>create long and wide airbridges. I have been using hot (110C)
>Ethylenediamine
>to etch the polyimide, but it does not seem to remove all of the
>material
>underneath the bridges. I have included holes to facilitate the
>diffusion of the
>etchant under the bridges as well as a stirrer, but to no avail. Does
>anyone
>know of other etchants that could be used to remove the polyimide;
>especially
>underneath the bridges? By the way, the bridges are made of chrome and
>electroplated gold. Therefore, the etchants cannot attack these metals.
>
>Thanks,
>
> Sergio
>
>--
>
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> ._,
> ,_| |._/\ Sergio Palma Pacheco
> | |o/^^~-._ Radiation Laboratory
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> \__/|_ /' University of Michigan
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> | __/'
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> ~~^\/' e-mail: [email protected]
>
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>
******************************************************
Dipl.-Ing. Ralf Keller
Fraunhofer-Institut fuer Biomedizinische Technik IBMT
Abteilung Sensorsysteme / Mikrosysteme
Ensheimer Str. 48
66386 St. Ingbert
Germany
Tel.: +49 (0) 6894 / 980-158
Fax: +49 (0) 6894 / 980-400
e-mail: [email protected]
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