Dear friends

I am trying to pattern SU-8 on the Cu seed layer and then do electroplating
of Cu. I applied Omnicoat, which can improve the adhesion between SU-8 and
metal layer according MicroChem, beneath the SU-8. But right during the
development, some of the SU-8 is gone. Then in the following electroplating
process, almost all the SU-8 is gone.

Does anyone can give me a hint on the improvement of SU-8 on metal such as
Au or Cu?

Thank you so much,

Zhiyan