Dear Zhiyan,

You will need to increase your exposure dose significantly when exposing
over gold or copper, especially when using Omnicoat. Try a 50% increase
and optimize your process from there.

Very Best Regards,
Rob Hardman

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From: Zhiyan Liu 
Subject: [mems-talk] Adhesion problem of SU-8 on metal surface

I am trying to pattern SU-8 on the Cu seed layer and then do electroplating
of Cu. I applied Omnicoat, which can improve the adhesion between SU-8 and
metal layer according MicroChem, beneath the SU-8. But right during the
development, some of the SU-8 is gone. Then in the following electroplating
process, almost all the SU-8 is gone.

Does anyone can give me a hint on the improvement of SU-8 on metal such as
Au or Cu?