Hi everyone,

has anybody tried to deposit polymers in an AOE chamber (Advanced Oxide
Etch, STS)? We have C4F8, C3F8, CF4, H2, O2, Ar, N2 and He connected to
the chamber and want to deposit Teflon-like PTFE layers on Pyrex. In the
ASE chamber (Bosch process) layers can be deposited at 1 micron / 5 min,
in the AOE the deposition rate is only around 10% of that. We do not want
to contaminate the ASE with too much polymer and therefore need to use the
AOE instead.
Has anybody tried this before and can suggest a set of parameters to start
from?

Thanks,

Marco