Dear all,

I am looking for a proper bonding and packaging technique for my mems
device.  The requirements are: 1, the device will works in high vacuum
(10e-9); 2, the device have to be baked at 200C for 1-2 days; 3, the cap
wafer contains a thin silicon membrane and 4th, the bottom wafer has
electroplated structure and therefore i wouldn't expect a very clean surface.

any references will be greatly appreciated.

Y.Zhang