Parijat,

If you buy regular AZ photoresist with your specified thickness,
spin-coat, and directly do hardbake, it won't dissolve or at least not
much in developer or DI water. You may or may not need to play with the
hardbake process for crosslinking the resist so that it won't be
photosensitive anymore.

Yours sincerely,

Isaac Chan, Ph.D.
University of Waterloo

On Thu, 26 May 2005, Parijat Bhatnagar wrote:

> 1) I am looking for an organic resist-like material which can form a 200 to
> 1500 nm thick coating by spinning. It should not dissolve in water or
> developer.
>
> 2) I also want to protect it from dissolving when I would spin the
> photoresist on it.
>
> Shipley's FSC-M or MicroChem MX 6C are two such material but I am not able
> to locate the datasheets for it on the internet or the company's web-site.