Hello

We made a couple of devices combining SU8 and electroformed Ni.
After release from the substrate we have a Ni film of about 50 um thickness
containing embedded SU8 structures of about 300 um
diameter/width (circular and rectangular shapes) and similar height.

After release we often observe that the bond between SU8 and Ni is
not very strong and that the SU8 structures come out of the Ni film
due to the large shrinkage of the SU8 compare to Ni.

Is anybody aware of any adhesion promoter to enhance the bond between
SU8 and Ni.
Could plasma treatment of the SU8 before Ni electroforming help?

Thanks for your help.
Jürgen