Hi,

I'm trying to etch glass using SF6/O2 chemistry. I need to etch deep (10um),
etch profile not important. I have tried 30 sccm SF6 with 3 sccm O2 at 450W
RIE power, low pressure, but am getting a very poor etch rate (8 nm/min).

Anyone with suggestions for process parameters? Alternative chemistry
suggestions (different source gases) are welcome.

Thanks in advance!

Regards,

Alok