Deposit thin Ti first, then Au.  After that, do plating.

Good luck.

Li

>From: "Krishna Vummidi" 
>Subject: [mems-talk] reg: electroplaing on 5214
>
>Im trying to electroplate(Au) on patterned resist (AZ 5214-IR). The problem
>i think, im facing is the resist adhesion on Au. Is it normal or does the
>electrolyte (from transene - SG-10) attacks 5214. would HMDS improve
>adhesion and help to electroplate?