On Sun, 12 Jun 2005 08:37:51 -0600 "li cai"  wrote:
> Deposit thin Ti first, then Au.  After that, do plating.
>

Krishna, As Li said , evaporating a thin Ti layer should work perfect in your
case. I have tried the same before and it worked for me. Au does not have a
very good adhesion to resist and you needa  Ti seed layer.

Sumant Sood
Belford Research