Does anyone have experience with the mechanical machining of thick
[approximately 4 mm thick] Silicon?

The finished part will be about 1.40 inches square and is about 0.150 inch thick
[3.81 mm]. I'd like to use primarily mechanical tools to drill and route the
part, such a grinding tools, and will probably not use etchants, FIB, etc., to
form the features.

The only holes on the part are two slots, 0.062" [1.57 mm] wide by 0.087" long.
All machined features on the part are planar, except for 4 beveled facets at 45
degrees.

We'd like to start with a 4 mm thick wafer, preferably 111 orientation.

Any advice on machining tools, techniques and providers would be appreciated.

Thanks

Michael Alderete
Mechanical Packaging Engineer
Sensor & Targeting Systems
DRS Technologies Inc.