Kris,

Hi.  I would suggest a chemical clean to remove any organics that could
be on the surface, followed by a 30min dehydration bake before placing
the material in your deposition chamber.

Sincerely,

Robert Dean
Auburn University

>>> [email protected] 06/16 11:36 PM >>>

I was sputtering Ti on Polyimide(PI2611). I did
presputter etch for a couple of minutes later followed
by thin Ti deposition and Au on top of it. The
substrate coated with PI was baked well and was
transferred to sputerrer immediately.

Ti does`nt stick well to the PI. AU peels of easily
with tape.