I think you will find there to be some release of fluorine from the teflon
holder during your oxygen plasma treatment. Fluorine and oxygen make for a good
oxide etchant in plasma. I have seen this release in wet processing also. Using
new teflon boats for silicon nitride strip in hot phosphoric acid we were able
to remove 500 angstroms of oxide under the silicon nitride and we traced it back
to the boats. Bob Henderson

-----Original Message-----
From: X.P. Zhu 
Subject: [mems-talk] Does O2 plasma attack teflon?

We use a teflon holder to hold wafers. I wonder
whether it can be etched during the wafer cleaning
process by using O2 plasma. Can anybody tell me?