Hi everyone,
    I am trying to lift-off about 0.2 microns of e-beamed Pt (20 nm Cr adhesion
layer) from a 3 micron polyimide (PI-2611) layer but keep finding cracks
occuring in the metal on the photoresist and polyimide. The deposition is
started after reaching a pressure ~1 x 10-6 Torr. I have tried this deposition
using both a water cooled platen and an uncooled platen with the same results.
For the lift-off we are using LOR A (Lift-Off Resist) and 1813.

Any suggestions apreciated,
    Mike Martin
    U. of Louisville