Instead of using photoresist to attach to the support wafer try using
crystal glue. To bond you have to put a few small pieces of the glue on your
support wafer and heat the wafer. The glue becomes viscous and you bond your
wafer and then cool it. to detach just heat the wafer again.

----- Original Message -----
From: "ZICKAR Michaël" 
Subject: RE: [mems-talk] Releasing cantilever beams

Try a dry process to release your fragile structures. You could use oxigen
plasma to remove the photoresist or a SOI-wafer technology and remove the
buried oxide with vapour HF. We did cantilevers on SOI substrate 300 nm
thick and used the vapour HF tool from Idonus (www.idonus.com) to release
them with a yield close to 100%.

Best regards,

Michael

-----Original Message-----
From: Tolga Kaya
Subject: [mems-talk] Releasing cantilever beams

Hi, I am trying to release my double clamped cantilever beams after KOH
etch. I etch my SOI wafer from bottom with KOH, then attach it onto a
support wafer using S1813 and do RIE from top. I put device with its supprt
wafer in Acetone for 1-2hours in order to make sure device is fully detached
from the support wafer. However, when I try to take the sample from acetone,
beams are broken.