Hi folks,

Does someone has experience in Ni lift-off on PMMA layer? We've been trying
to pattern Ni on PMMA layer by lift-off process. We are dealing with tow
problems here. One is how to improve Ni ahesion to PMMA layer (underneath Cr
layer has been used) so that the Ni pattern can survive in lift-off process.
And the other one is how to remove photoresist quickly and completely. The
photoresist is AZ1518. The photoresist layer is patterned by lithography and
RIE (O2/Ar) processed. It was found that photoresist with the Cr/Ni layer
didn't lift-off when soaked in MIF327/IPA solution and shaked in ultrasonic
even for 30mins.

Thank you for your suggestion

David

University of Illionis at Urbana-Champaign.