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MEMSnet Home: MEMS-Talk: KOH Wet Etching of Si wafers
Photoresist for Lift-off process
2005-08-02
Richard Chang
2005-08-03
Bill Moffat
2005-08-05
Brubaker Chad
2005-08-08
Huy Vo
KOH Wet Etching of Si wafers
2005-08-09
Daniel Park
2005-08-10
Shay Kaplan
2005-08-12
Christian Schröder
2005-08-12
Josef Kouba
2005-08-09
Wilson, Thomas
2005-08-11
Boyd Evans
KOH Wet Etching of Si wafers
Shay Kaplan
2005-08-10
Daniel,
140nm of LPCVD nitride is enough for few mm thick Si etch in KOH. You
shouldn't have any problem.
shay

-----Original Message-----
From: Daniel Park
Subject: [mems-talk] KOH Wet Etching of Si wafers

I am trying to etch the center area (2.5 inch diameter) of the backside of
500 um thick Si wafers (4inch diameter) using KOH wet etching process. I am
considering to use 300 nm LPCVD nitride to protect the edge area of the Si
backside. I am just wondering whether 300 nm thick nitride will be enough to
etch the center area of 500 um thick Si wafers.
reply
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