Hello All,

I am trying to etch PI2611 of about 14 microns over
the gold bond pads. The bondpads were electroplated. I
am using Al mask for the polyimide etch. After the
etch i have observed that the strings of polyimide
coming off along the preiphery of the bond pads. These
strings appear to be thinner compared to the original
polyimide layer. I was wondering if anyone has
encountered similar kind of problems??

Please provide me any suggestions on this.

Thanks
Kris