Steve/ahajjiah,
              A guaranteed simple lift off process using any positive
photo resist dimensions of below 0.1 micron rock solid production
process with no painful variables and side walls with a 22 degree
overhang.  Let me know if you want to run free tests and get technical
papers on the process.  We have also run resists as thick as 40 microns
for copper plating up in this case vertical side walls.


Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353