Hi,

I am trying to build MEMS DC switches using both cantilevers and bridges.  I
want to fabricate a contact dimple using a bilayer photoresist process.  I
could get the dimple topography I wanted on the sacrificial layer by
consecutively spinning and patterning two layers of AZ4110 in the past.
However, now when I spin the second layer, it seems to dissolve the first
layer where the dimple indentation is.

Does anybody have a relatively straight-forwards recipe for fabricating
contact dimples?

Thank you very much.


erkin