Hai Lee,

     The desired temperature for hard bake what I use is 200°C for 30 mins
I will ramp from RT to 200°c in 30 mins and keep the wafer for 30mins @
200°C..

     Let the wafer rest it on the hot plate itself..so that there wont be
any problem of peeling of sructures due to stress...

To avoid stress, In any baking process the wafer has to cool it down very
slowly on hot plate or at a rate of ~2°C per min

Hope this is sufficient for your doubt..

Regards,

Riyaz Pasha Shaik

>
> > From: "Chen-Han Lee" 
> To: "Mems-Talk" 
> Date: Mon, 19 Sep 2005 15:58:18 +0100
> Subject: [mems-talk] su-8 hardbake
>
> hi,
>
> could anyone tell what temperature and duration is usually used in
> hardbake
> for su-8?
> Once reached the desired time, do u remove it from the hotplate or turn
> the
> hotplate off and leave the su-8 sample on it?
>