Hai every one,
                I am working on SU 8 2100  to get 500microns as thickness
on the substrate, I have tried few spin speeds and spin time's for
achieving 500microns,I want to get the thickness uniformity of SU 8 resist
on wafer with minimum deviation on the whole wafer...

1) Does any one have any idea whether uniformity of  SU 8 resist level
has major effect  during resting period after spin coat or during Soft
bake?

 2) During resting period (after spin coating) should I leave the resist
wafer close with lid to get better reflow of resist on the whole wafer.

I would be thankfull for the people who has posted their valuable
suggestion to my post..

Regards,
Riyaz