Hi Everybody
I am exposing PMMA as a negative resist.I am trying to etch Silicon by using
PMMA as mask.Gases used are Oxygen(30 SCCM) and CF4(6 SCCM) ..I tried it for
5 min and 30 min.Unfortunately whole PMMA gets removed and I don't have
anything left on Silicon wafer..Can anybody please suggest me the
appropriate gases , power , etch time and gas pressure

Thank You
Karan